Qalabka: CuNi5 CuNi10(C70600) CuNi20 (C71000) CuNi25(C71300), CuNi30(C71500) oo laga soo qaatay xaashi/saxan/xarig
Sharaxaadda Badeecada
Daloolada kuleylinta ee CuNi23Mn ee iska caabbinta hooseeya waxaa si weyn loogu isticmaalaa jebinta wareegga danab-yar, gudbinta xad-dhaafka kulaylka, iyo alaabada kale ee korontada ee danab-yar. Waa mid ka mid ah agabka muhiimka ah ee alaabada korontada ee danab-yar. Agabka ay soo saarto shirkaddayadu wuxuu leeyahay astaamaha isku-dheellitirka iska caabbinta wanaagsan iyo xasilloonida sare. Waxaan bixin karnaa dhammaan noocyada silig wareegsan, fidsan iyo walxaha xaashida ah.
Waxyaabaha Kiimikada, %
| Ni | Mn | Fe | Si | Cu | Kale | Tilmaamaha ROHS | |||
| Cd | Pb | Hg | Cr | ||||||
| 30 | 1.0 | - | - | Bal | - | ND | ND | ND | ND |
Sifooyinka Farsamada
| Heerkulka Adeegga Joogtada ah ee Ugu Badan | 350ºC |
| Adkeysiga 20ºC | 0.35%ohm mm2/m |
| Cufnaanta | 8.9 g/cm3 |
| Qaboojinta Kulaylka | 10 (Ugu badnaan) |
| Barta Dhalmada | 1170ºC |
| Xoog la jiidi karo, N/mm2 La xidhxidhay, Jilicsan | 400 Mpa |
| Xoog La jiidi karo, N/mm2 La duubay qabow | Mpa |
| Dheellitir (sannad) | 25% (Ugu badnaan) |
| Dheellitir (qabow la duubay) | (Ugu badnaan) |
| EMF vs Cu, μV/ºC (0 ~ 100ºC) | -37 |
| Qaab-dhismeedka Micrographic | austenit |
| Hantida Birlabta ah | Aan ahayn |
Daawaha iska caabbinta - Cabbirrada CuNi30Mn / Awoodaha Heerkulka
Xaalad: Iftiin, Buuxsan, Jilicsan
Dhexroorka siligga 0.02mm-1.0mm baakad ku jirta, oo ka weyn baakad 1.0mm ah oo ku jirta gariiradda
Usha, dhexroorka Baarka 1mm-30mm
Xarigga: Dhumucdiisuna waa 0.01mm-7mm, Ballaca waa 1mm-280mm
Xaalad la isku dhejiyay ayaa la heli karaa
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